Impact of BOX thickness and ground-plane on non-linearity of UTBB FD-SOI MOS transistors
Source
2018 Joint International Eurosoi Workshop and International Conference on Ultimate Integration on Silicon Eurosoi Ulis 2018
Date Issued
2018-05-03
Author(s)
Bhoir, Mandar S.
Abstract
This work investigates, for the first time, the impact of BOX thickness (T<inf>box</inf>) and Ground-plane (GP) on the non-linearity of transistors fabricated using UTBB FD-SOI CMOS technology. By extracting 2<sup>nd</sup> and 3<sup>rd</sup> order harmonic distortions, we have shown that the TBOX scaling and GP improve the transistor linearity at lower drain currents (low-power applications) in advanced FD-SOI technology nodes. The physics behind this observation i.e the additional mobility limiting factors, is explained in detail by using well calibrated TCAD simulations.
Subjects
BOX thickness scaling | Ground-plane | linearity | mobility | TCAD | UTBB FD-SOI
